Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Woo Young | - |
dc.contributor.author | Jang, Ji-un | - |
dc.contributor.author | Lee, Hun Su | - |
dc.contributor.author | Kim, Seong Yun | - |
dc.date.accessioned | 2024-01-19T14:00:59Z | - |
dc.date.available | 2024-01-19T14:00:59Z | - |
dc.date.created | 2022-01-10 | - |
dc.date.issued | 2021-09 | - |
dc.identifier.issn | 0272-8397 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/116502 | - |
dc.description.abstract | The recycling of waste resources is not optional but rather essential to achieve a sustainable human future. In this study, the feasibility of carbonized wood flour (CWF) as a conductive filler was evaluated for improving the electrical conductivity of polymer composites because wood flour is a sustainable and promising precursor for CWF filler, as a naturally abundant and industrially steady resource. The optimized electrical conductivity of the composite with 25 wt% CWF post-treated by the inductively coupled plasma (ICP), proposed in this study, was 71 S/m, exceeding that of the carbon black (CB)-filled composite (12 S/m). In addition, the estimated production cost of ICP treated CWF ($1.35-1.55/kg) was about 22.5%-32.5% lower than that of commercial CB ($2/kg). Therefore, the CWF was an effective, economical, and eco-friendly conductive filler to enhance the electrical conductivity of polymer composites. | - |
dc.language | English | - |
dc.publisher | John Wiley & Sons Inc. | - |
dc.title | Electrical conductivity of polymer composites based on carbonized wood flour via plasma post-treatment as an effective and economical filler | - |
dc.type | Article | - |
dc.identifier.doi | 10.1002/pc.26191 | - |
dc.description.journalClass | 1 | - |
dc.identifier.bibliographicCitation | Polymer Composites, v.42, no.9, pp.4814 - 4821 | - |
dc.citation.title | Polymer Composites | - |
dc.citation.volume | 42 | - |
dc.citation.number | 9 | - |
dc.citation.startPage | 4814 | - |
dc.citation.endPage | 4821 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.identifier.wosid | 000668355400001 | - |
dc.identifier.scopusid | 2-s2.0-85108913721 | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Composites | - |
dc.relation.journalWebOfScienceCategory | Polymer Science | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Polymer Science | - |
dc.type.docType | Article | - |
dc.subject.keywordPlus | THERMAL-CONDUCTIVITY | - |
dc.subject.keywordPlus | SURFACE-TREATMENT | - |
dc.subject.keywordPlus | FIELD-EMISSION | - |
dc.subject.keywordPlus | FABRICATION | - |
dc.subject.keywordPlus | PERCOLATION | - |
dc.subject.keywordPlus | NANOTUBES | - |
dc.subject.keywordPlus | CELLULOSE | - |
dc.subject.keywordPlus | GRAPHENE | - |
dc.subject.keywordPlus | BEHAVIOR | - |
dc.subject.keywordAuthor | composites | - |
dc.subject.keywordAuthor | fillers | - |
dc.subject.keywordAuthor | processing | - |
dc.subject.keywordAuthor | structure-property relations | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.