Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Thieu, Nhat Anh Thi | - |
dc.contributor.author | Vu, Minh Canh | - |
dc.contributor.author | Kim, Dae Hoon | - |
dc.contributor.author | Choi, Won Kook | - |
dc.contributor.author | Kim, Sung-Ryong | - |
dc.date.accessioned | 2024-01-19T16:31:49Z | - |
dc.date.available | 2024-01-19T16:31:49Z | - |
dc.date.created | 2022-01-25 | - |
dc.date.issued | 2020-10 | - |
dc.identifier.issn | 1042-7147 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/118021 | - |
dc.description.abstract | The composites comprising vertically aligned network of copper nanowires (CuNWs) in the presence of cellulose nanofibers were fabricated by using the freeze-templating method and the effect of aspect ratio (A/R) of CuNWs on the thermal conductivity of epoxy composites was investigated. The thermal conductivity of epoxy composites increased to 0.79 W m(-1) K-1 at 1.12 vol% of high A/R CuNWs loading, corresponding to the thermal conductivity enhancement of 365% as compared to the pure epoxy. The thermal conductivity of vertically aligned higher A/R CuNWs/epoxy, which is 38.5% and 51.9% higher than those of the lower A/R CuNWs and the randomly aligned CuNWs, respectively. The application of the epoxy composites in heat dissipation was demonstrated by the temperature changes of composites on a hot plate with the increase of heating time. These results indicate that the thermally conductive composites in this study could be applied for thermal dissipating materials in electronic devices. | - |
dc.language | English | - |
dc.publisher | WILEY | - |
dc.title | Effect of aspect ratio of vertically aligned copper nanowires in the presence of cellulose nanofibers on the thermal conductivity of epoxy composites | - |
dc.type | Article | - |
dc.identifier.doi | 10.1002/pat.4954 | - |
dc.description.journalClass | 1 | - |
dc.identifier.bibliographicCitation | POLYMERS FOR ADVANCED TECHNOLOGIES, v.31, no.10, pp.2351 - 2359 | - |
dc.citation.title | POLYMERS FOR ADVANCED TECHNOLOGIES | - |
dc.citation.volume | 31 | - |
dc.citation.number | 10 | - |
dc.citation.startPage | 2351 | - |
dc.citation.endPage | 2359 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.identifier.wosid | 000538626800001 | - |
dc.identifier.scopusid | 2-s2.0-85086095267 | - |
dc.relation.journalWebOfScienceCategory | Polymer Science | - |
dc.relation.journalResearchArea | Polymer Science | - |
dc.type.docType | Article | - |
dc.subject.keywordPlus | BORON-NITRIDE | - |
dc.subject.keywordPlus | POLYMER COMPOSITES | - |
dc.subject.keywordPlus | SEGREGATED NETWORK | - |
dc.subject.keywordPlus | CARBON NANOTUBES | - |
dc.subject.keywordPlus | ENHANCEMENT | - |
dc.subject.keywordPlus | PERFORMANCE | - |
dc.subject.keywordPlus | FILLERS | - |
dc.subject.keywordPlus | BEADS | - |
dc.subject.keywordPlus | PAPER | - |
dc.subject.keywordPlus | FILM | - |
dc.subject.keywordAuthor | aspect ratio | - |
dc.subject.keywordAuthor | copper nanowires | - |
dc.subject.keywordAuthor | thermal conductivity | - |
dc.subject.keywordAuthor | thermal management | - |
dc.subject.keywordAuthor | vertically aligned network | - |
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