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dc.contributor.authorThieu, Nhat Anh Thi-
dc.contributor.authorVu, Minh Canh-
dc.contributor.authorKim, Dae Hoon-
dc.contributor.authorChoi, Won Kook-
dc.contributor.authorKim, Sung-Ryong-
dc.date.accessioned2024-01-19T16:31:49Z-
dc.date.available2024-01-19T16:31:49Z-
dc.date.created2022-01-25-
dc.date.issued2020-10-
dc.identifier.issn1042-7147-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/118021-
dc.description.abstractThe composites comprising vertically aligned network of copper nanowires (CuNWs) in the presence of cellulose nanofibers were fabricated by using the freeze-templating method and the effect of aspect ratio (A/R) of CuNWs on the thermal conductivity of epoxy composites was investigated. The thermal conductivity of epoxy composites increased to 0.79 W m(-1) K-1 at 1.12 vol% of high A/R CuNWs loading, corresponding to the thermal conductivity enhancement of 365% as compared to the pure epoxy. The thermal conductivity of vertically aligned higher A/R CuNWs/epoxy, which is 38.5% and 51.9% higher than those of the lower A/R CuNWs and the randomly aligned CuNWs, respectively. The application of the epoxy composites in heat dissipation was demonstrated by the temperature changes of composites on a hot plate with the increase of heating time. These results indicate that the thermally conductive composites in this study could be applied for thermal dissipating materials in electronic devices.-
dc.languageEnglish-
dc.publisherWILEY-
dc.titleEffect of aspect ratio of vertically aligned copper nanowires in the presence of cellulose nanofibers on the thermal conductivity of epoxy composites-
dc.typeArticle-
dc.identifier.doi10.1002/pat.4954-
dc.description.journalClass1-
dc.identifier.bibliographicCitationPOLYMERS FOR ADVANCED TECHNOLOGIES, v.31, no.10, pp.2351 - 2359-
dc.citation.titlePOLYMERS FOR ADVANCED TECHNOLOGIES-
dc.citation.volume31-
dc.citation.number10-
dc.citation.startPage2351-
dc.citation.endPage2359-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.identifier.wosid000538626800001-
dc.identifier.scopusid2-s2.0-85086095267-
dc.relation.journalWebOfScienceCategoryPolymer Science-
dc.relation.journalResearchAreaPolymer Science-
dc.type.docTypeArticle-
dc.subject.keywordPlusBORON-NITRIDE-
dc.subject.keywordPlusPOLYMER COMPOSITES-
dc.subject.keywordPlusSEGREGATED NETWORK-
dc.subject.keywordPlusCARBON NANOTUBES-
dc.subject.keywordPlusENHANCEMENT-
dc.subject.keywordPlusPERFORMANCE-
dc.subject.keywordPlusFILLERS-
dc.subject.keywordPlusBEADS-
dc.subject.keywordPlusPAPER-
dc.subject.keywordPlusFILM-
dc.subject.keywordAuthoraspect ratio-
dc.subject.keywordAuthorcopper nanowires-
dc.subject.keywordAuthorthermal conductivity-
dc.subject.keywordAuthorthermal management-
dc.subject.keywordAuthorvertically aligned network-
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