Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kang, Jiheong | - |
dc.contributor.author | Son, Donghee | - |
dc.contributor.author | Vardoulis, Orestis | - |
dc.contributor.author | Mun, Jaewan | - |
dc.contributor.author | Matsuhisa, Naoji | - |
dc.contributor.author | Kim, Yeongin | - |
dc.contributor.author | Kim, Jaemin | - |
dc.contributor.author | Tok, Jeffrey B-H | - |
dc.contributor.author | Bao, Zhenan | - |
dc.date.accessioned | 2024-01-19T20:33:25Z | - |
dc.date.available | 2024-01-19T20:33:25Z | - |
dc.date.created | 2021-09-02 | - |
dc.date.issued | 2019-03 | - |
dc.identifier.issn | 2365-709X | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/120290 | - |
dc.description.abstract | Electronics offering modularity in design and function, i.e., modular electronics have enabled a wide gamut of applications, such as promotion of creativity, self-assembling robots, and customizable consumer electronics. In particular, there is recently a fertile application domain within the rapidly growing needs in wearable technologies. Toward this application, it is proposed that stretchable, self-healable, and mechanically tough materials will enable a highly desirable reconfigurable multifunctional and modular platform for wearable electronics. Here, the novel applications of tough self-healing elastomer are reported to realize skin-like modular electronics system,, i.e., stretchable, tough, self-healable, and reconfigurable, in which multiple electronic components are electrically interconnected and can effectively communicate with each other digitally. The fabricated self-healing conductive lines can also allow for components that can be readily cut, reconfigured, and reconnected by the user. | - |
dc.language | English | - |
dc.publisher | WILEY | - |
dc.subject | COMPOSITE | - |
dc.title | Modular and Reconfigurable Stretchable Electronic Systems | - |
dc.type | Article | - |
dc.identifier.doi | 10.1002/admt.201800417 | - |
dc.description.journalClass | 1 | - |
dc.identifier.bibliographicCitation | ADVANCED MATERIALS TECHNOLOGIES, v.4, no.3 | - |
dc.citation.title | ADVANCED MATERIALS TECHNOLOGIES | - |
dc.citation.volume | 4 | - |
dc.citation.number | 3 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.identifier.wosid | 000461232400019 | - |
dc.identifier.scopusid | 2-s2.0-85058958114 | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.type.docType | Article | - |
dc.subject.keywordPlus | COMPOSITE | - |
dc.subject.keywordAuthor | modular electronics | - |
dc.subject.keywordAuthor | reconfigurable electronics | - |
dc.subject.keywordAuthor | self-healing chemistry | - |
dc.subject.keywordAuthor | stretchable electronics | - |
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