DSpace at KISTKIST Article2016

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dc.contributor.authorLiang, Junge-
dc.contributor.authorKim, Eun Seong-
dc.contributor.authorWang, Cong-
dc.contributor.authorYoun, Je-Hyun-
dc.contributor.authorPark, Min Chul-
dc.contributor.authorKim, Nam Young-
dc.date.accessioned2024-01-20T05:03:50Z-
dc.date.available2024-01-20T05:03:50Z-
dc.date.created2022-01-25-
dc.date.issued2016-01-
dc.identifier.issn0895-2477-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/124528-
dc.languageEnglish-
dc.publisherWILEY-BLACKWELL-
dc.titleAN ON-WAFER EMBEDDED PASSIVE DEVICE USING CHIP-IN-SUBSTRATE PACKAGING TECHNOLOGY (vol 57, pg 2060, 2015)-
dc.typeArticle-
dc.identifier.doi10.1002/mop.29540-
dc.description.journalClass1-
dc.identifier.bibliographicCitationMICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.58, no.1, pp.249 - 249-
dc.citation.titleMICROWAVE AND OPTICAL TECHNOLOGY LETTERS-
dc.citation.volume58-
dc.citation.number1-
dc.citation.startPage249-
dc.citation.endPage249-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.identifier.wosid000365756600061-
dc.identifier.scopusid2-s2.0-84948845139-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryOptics-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaOptics-
dc.type.docTypeCorrection-
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KIST Article > 2016
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