Self-assembled block copolymer micelles with silver-carbon nanotube hybrid fillers for high performance thermal conduction

Authors
Choi, Jae RyungYu, SeunggunJung, HaejongHwang, Sun KakKim, Richard HahnkeeSong, GiyoungCho, Sung HwanBae, InsungHong, Soon ManKoo, Chong MinPark, Cheolmin
Issue Date
2015-02
Publisher
ROYAL SOC CHEMISTRY
Citation
NANOSCALE, v.7, no.5, pp.1888 - 1895
Abstract
The development of polymer-filled composites with an extremely high thermal conductivity (TC) that is competitive with conventional metals is in great demand due to their cost-effective process, light weight, and easy shape-forming capability. A novel polymer composite with a large thermal conductivity of 153 W m(-1) K-1 was prepared based on self-assembled block copolymer micelles containing two different fillers of micron-sized silver particles and multi-walled carbon nanotubes. Simple mechanical mixing of the components followed by conventional thermal compression at a low processing temperature of 160 degrees C produced a novel composite with both structural and thermal stability that is durable for high temperature operation up to 150 degrees C as well as multiple heating and cooling cycles of Delta T = 100 degrees C. The high performance in thermal conduction of our composite was mainly attributed to the facile deformation of Ag particles during the mixing in a viscous thermoplastic medium, combined with networked carbon nanotubes uniformly dispersed in the nanoscale structural matrix of block copolymer micelles responsible for its high temperature mechanical stability. Furthermore, micro-imprinting on the composite allowed for topographically periodic surface micropatterns, which offers broader suitability for numerous micro-opto-electronic systems.
Keywords
HEXAGONAL BORON-NITRIDE; GRAPHITE NANOPLATELET; INTERFACE; NANOCOMPOSITES; GRAPHENE; COMPOSITES; POLYIMIDE; TRANSPORT; BEHAVIOR; FILMS; HEXAGONAL BORON-NITRIDE; GRAPHITE NANOPLATELET; INTERFACE; NANOCOMPOSITES; GRAPHENE; COMPOSITES; POLYIMIDE; TRANSPORT; BEHAVIOR; FILMS; thermal conductive composite; Ag; CNT; block copolymer
ISSN
2040-3364
URI
https://pubs.kist.re.kr/handle/201004/125800
DOI
10.1039/c4nr06390b
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KIST Article > 2015
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