Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Jin-Seong | - |
dc.contributor.author | Han, Jae-Min | - |
dc.contributor.author | Joung, Mi-Ri | - |
dc.contributor.author | Kweon, Sang-Hyo | - |
dc.contributor.author | Kang, Chong-Yun | - |
dc.contributor.author | Nahm, Sahn | - |
dc.date.accessioned | 2024-01-20T08:33:13Z | - |
dc.date.available | 2024-01-20T08:33:13Z | - |
dc.date.created | 2021-09-02 | - |
dc.date.issued | 2014-11 | - |
dc.identifier.issn | 0272-8842 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/126204 | - |
dc.description.abstract | Crystalline (Zr,Ti)(0.85)(Ca,Sr)(0.15)O-1.85 (ZTCS) films were grown on a Pt/Ti/SiO2/Si substrate at various temperatures by using rf-magnetron sputtering. The ZTCS films had a cubic stabilized zirconia structure. The dielectric constant (k) of the ZTCS film grown at 300 degrees C was approximately 30.5 with a low tan delta value of 0.007 at 100 kHz. Further, this film exhibited a similar k value of 30.4 and a high quality factor of 225 at 1.0 GHz. Moreover, it showed a high capacitance density of 290 nF/cm(2) with a small TCC of -60.7 ppm/degrees C at 100 kHz. A low leakage current (1.4 x 10(-8) A/cm(2) at 1.5 MV/cm) with a high breakdown electric field (1.85 MV/cm) was also observed in this film; the leakage current of this film was explained by Schottky emission. Therefore, it can be concluded that ZTCS films grown at low temperatures ( <= 300 degrees C) are good candidates for use as embedded capacitor in printed circuit boards. (c) 2014 Elsevier Ltd and Techna Group S.r.l. All rights reserved. | - |
dc.language | English | - |
dc.publisher | ELSEVIER SCI LTD | - |
dc.subject | DECOUPLING CAPACITORS | - |
dc.subject | EMBEDDED CAPACITORS | - |
dc.subject | MIM CAPACITORS | - |
dc.subject | TEMPERATURE | - |
dc.subject | RESISTORS | - |
dc.subject | BEHAVIOR | - |
dc.subject | LEAKAGE | - |
dc.title | Electrical properties of (Zr,Ti)(0.85)(Ca,Sr)(0.15)O-1.85 thin film grown on Pt/Ti/SiO2/Si substrate using RF magnetron sputtering | - |
dc.type | Article | - |
dc.identifier.doi | 10.1016/j.ceramint.2014.06.093 | - |
dc.description.journalClass | 1 | - |
dc.identifier.bibliographicCitation | CERAMICS INTERNATIONAL, v.40, no.9, pp.14957 - 14964 | - |
dc.citation.title | CERAMICS INTERNATIONAL | - |
dc.citation.volume | 40 | - |
dc.citation.number | 9 | - |
dc.citation.startPage | 14957 | - |
dc.citation.endPage | 14964 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.identifier.wosid | 000341343300052 | - |
dc.identifier.scopusid | 2-s2.0-84906101325 | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Ceramics | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.type.docType | Article | - |
dc.subject.keywordPlus | DECOUPLING CAPACITORS | - |
dc.subject.keywordPlus | EMBEDDED CAPACITORS | - |
dc.subject.keywordPlus | MIM CAPACITORS | - |
dc.subject.keywordPlus | TEMPERATURE | - |
dc.subject.keywordPlus | RESISTORS | - |
dc.subject.keywordPlus | BEHAVIOR | - |
dc.subject.keywordPlus | LEAKAGE | - |
dc.subject.keywordAuthor | Dielectric | - |
dc.subject.keywordAuthor | Thin film | - |
dc.subject.keywordAuthor | Embedded capacitor | - |
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