Thermal conductivity behavior of SiC-Nylon 6,6 and hBN-Nylon 6,6 composites

Abstract

A study was performed to determine the effect of the content and orientation of fillers on the thermal conductivity of a polymeric composite packed with hexagonal boron nitride (hBN) and silicon carbide (SiC) fillers. The thermal conductivity behavior of SiC-Nylon 6,6 and hBN-Nylon 6,6 composites was more dependent on the orientation and shape of the filler than on its thermal conductivity. The thermal conductivity of SiC-Nylon 6,6 composites with 59 % (v/v) isotropic SiC fillers increased from 0.25 to 3.83 W/m K. That of hBN-Nylon 6,6 composites with 62 % (v/v) anisotropic hBN fillers increased from 0.25 to 2.16 W/m K in the perpendicular direction whereas in the parallel direction it increased rapidly to 8.55 W/m K.