Piezoelectric properties of highly densified 0.01Pb (Mg1/2W1/2) O-3-0.41Pb (Ni1/3Nb2/3)O-3-0.35PbTiO(3)-0.23PbZrO(3)+0.1 wt% Y2O3+1.5 wt% ZnO thick films on alumina substrate

Abstract

This paper reports on the formation of highly densified piezoelectric thick films of 0.01Pb(Mg1/2W1/2)O-3-0.41Pb(Ni1/3Nb2/3)O-3-0.35PbTiO(3)-0.23PbZrO(3)+0.1 wt% Y2O3+1.5 wt% ZnO (PMW-PNN-PT-PZ+YZ) on alumina substrate by the screen-printing method. To increase the packing density of powder in screen-printing paste, attrition milled nano-scale powder was mixed with ball milled micro-scale powder, while the particle size distribution was properly controlled. Furthermore, the cold isostatic pressing process was used to improve the green density of the piezoelectric thick films. As a result of these processes, the PMW-PNN-PT-PZ+YZ thick film, sintered at 890 degrees C for 2 h, showed enhanced piezoelectric properties such as P-r=42 mu C/cm(2), E-c=25 kV/cm, and d(33)=100 pC/N, in comparison with other reports. Such prominent piezoelectric properties of PMW-PNN-PT-PZ+YZ thick films using bi-modal particle distribution and the CIP process can be applied to functional thick films in MEMS applications such as micro actuators and sensors. (C) 2012 Elsevier Ltd and Techna Group S.r.l. All rights reserved.