Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Cho, Y.H. | - |
dc.contributor.author | Lee, K.J. | - |
dc.contributor.author | Moon, D.J. | - |
dc.contributor.author | Kim, Y.H. | - |
dc.date.accessioned | 2024-01-20T18:01:14Z | - |
dc.date.available | 2024-01-20T18:01:14Z | - |
dc.date.created | 2021-09-02 | - |
dc.date.issued | 2011-01 | - |
dc.identifier.issn | 1226-4881 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/130770 | - |
dc.description.abstract | The performance of microchannel PCHE (Printed Circuit Heat Exchanger) is superior to that of other existing commercial heat exchangers. Further, it is also more efficient than other heat exchangers. Various microchannels, whose shapes are straight (I), Wavy, Beehive, Surf, I-Wavy, I-Beehive, or I-Surf, are computationally modeled in this study. The counter-flow arrangement is used, and the flow characteristics, heat transfer, and pressure drop in the microchannels under various mass flow rate conditions are investigated. The results for I microchannel is chosen as the benchmarks and is compared with those of newly proposed microchannels. It is found that the surf-shaped microchannel is most efficient in improving the overall performance of a PCHE. ? 2011 The Korean Society of Mechanical Engineers. | - |
dc.language | Korean | - |
dc.publisher | 대한기계학회 | - |
dc.title | 마이크로채널 형상에 따른 PCHE 열유동 수치해석 | - |
dc.title.alternative | Numerical simulation of thermal performance of printed circuit heat exchangers with microchannels of different shapes | - |
dc.type | Article | - |
dc.identifier.doi | 10.3795/KSME-B.2011.35.1.061 | - |
dc.description.journalClass | 1 | - |
dc.identifier.bibliographicCitation | Transactions of the KSME, B, v.35, no.1, pp.61 - 66 | - |
dc.citation.title | Transactions of the KSME, B | - |
dc.citation.volume | 35 | - |
dc.citation.number | 1 | - |
dc.citation.startPage | 61 | - |
dc.citation.endPage | 66 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scopus | - |
dc.description.journalRegisteredClass | kci | - |
dc.identifier.kciid | ART001505302 | - |
dc.identifier.scopusid | 2-s2.0-79551492883 | - |
dc.type.docType | Article | - |
dc.subject.keywordPlus | Flow arrangements | - |
dc.subject.keywordPlus | Flow characteristic | - |
dc.subject.keywordPlus | Mass flow rate | - |
dc.subject.keywordPlus | Numerical simulation | - |
dc.subject.keywordPlus | PCHE | - |
dc.subject.keywordPlus | Printed circuit heat exchangers | - |
dc.subject.keywordPlus | Thermal Performance | - |
dc.subject.keywordPlus | Computer simulation | - |
dc.subject.keywordPlus | Electronic equipment manufacture | - |
dc.subject.keywordPlus | Heat exchangers | - |
dc.subject.keywordPlus | Heat transfer | - |
dc.subject.keywordPlus | Mathematical models | - |
dc.subject.keywordPlus | Pressure drop | - |
dc.subject.keywordPlus | Printed circuits | - |
dc.subject.keywordPlus | Microchannels | - |
dc.subject.keywordAuthor | Heat transfer | - |
dc.subject.keywordAuthor | Microchannel | - |
dc.subject.keywordAuthor | Numerical simulation | - |
dc.subject.keywordAuthor | PCHE | - |
dc.subject.keywordAuthor | Pressure drop | - |
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