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dc.contributor.authorCho, Y.H.-
dc.contributor.authorLee, K.J.-
dc.contributor.authorMoon, D.J.-
dc.contributor.authorKim, Y.H.-
dc.date.accessioned2024-01-20T18:01:14Z-
dc.date.available2024-01-20T18:01:14Z-
dc.date.created2021-09-02-
dc.date.issued2011-01-
dc.identifier.issn1226-4881-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/130770-
dc.description.abstractThe performance of microchannel PCHE (Printed Circuit Heat Exchanger) is superior to that of other existing commercial heat exchangers. Further, it is also more efficient than other heat exchangers. Various microchannels, whose shapes are straight (I), Wavy, Beehive, Surf, I-Wavy, I-Beehive, or I-Surf, are computationally modeled in this study. The counter-flow arrangement is used, and the flow characteristics, heat transfer, and pressure drop in the microchannels under various mass flow rate conditions are investigated. The results for I microchannel is chosen as the benchmarks and is compared with those of newly proposed microchannels. It is found that the surf-shaped microchannel is most efficient in improving the overall performance of a PCHE. ? 2011 The Korean Society of Mechanical Engineers.-
dc.languageKorean-
dc.publisher대한기계학회-
dc.title마이크로채널 형상에 따른 PCHE 열유동 수치해석-
dc.title.alternativeNumerical simulation of thermal performance of printed circuit heat exchangers with microchannels of different shapes-
dc.typeArticle-
dc.identifier.doi10.3795/KSME-B.2011.35.1.061-
dc.description.journalClass1-
dc.identifier.bibliographicCitationTransactions of the KSME, B, v.35, no.1, pp.61 - 66-
dc.citation.titleTransactions of the KSME, B-
dc.citation.volume35-
dc.citation.number1-
dc.citation.startPage61-
dc.citation.endPage66-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscopus-
dc.description.journalRegisteredClasskci-
dc.identifier.kciidART001505302-
dc.identifier.scopusid2-s2.0-79551492883-
dc.type.docTypeArticle-
dc.subject.keywordPlusFlow arrangements-
dc.subject.keywordPlusFlow characteristic-
dc.subject.keywordPlusMass flow rate-
dc.subject.keywordPlusNumerical simulation-
dc.subject.keywordPlusPCHE-
dc.subject.keywordPlusPrinted circuit heat exchangers-
dc.subject.keywordPlusThermal Performance-
dc.subject.keywordPlusComputer simulation-
dc.subject.keywordPlusElectronic equipment manufacture-
dc.subject.keywordPlusHeat exchangers-
dc.subject.keywordPlusHeat transfer-
dc.subject.keywordPlusMathematical models-
dc.subject.keywordPlusPressure drop-
dc.subject.keywordPlusPrinted circuits-
dc.subject.keywordPlusMicrochannels-
dc.subject.keywordAuthorHeat transfer-
dc.subject.keywordAuthorMicrochannel-
dc.subject.keywordAuthorNumerical simulation-
dc.subject.keywordAuthorPCHE-
dc.subject.keywordAuthorPressure drop-
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KIST Article > 2011
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