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dc.contributor.authorLee, D.-H.-
dc.contributor.authorKim, B.-K.-
dc.contributor.authorJe, H.-J.-
dc.date.accessioned2024-01-20T20:31:48Z-
dc.date.available2024-01-20T20:31:48Z-
dc.date.created2021-09-02-
dc.date.issued2009-11-
dc.identifier.issn1225-0562-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/132020-
dc.description.abstractBaTiO3/epoxy composites have been widely investigated as promising materials for embedded capacitors in printed circuit boards. It is generally known that the dielectric constant (K) of the BaTiO3/epoxy composites increases with improvement of the dispersion of BaTiO3 particles in the epoxy matrix that comes from adding surfactant. The influences of surfactant addition on the dielectric properties of the BaTiO3/epoxy composites are reported in the present study. The dielectric constant of the BaTiO3/epoxy composites is not significantly affected by the surfactant addition. However, the temperature coefficient of capacitance increases and the peel strength decreases as the amount of added surfactant increases. The influences of surfactant addition on the dielectric properties of the neat epoxy are also very similar to those of the BaTiO3/epoxy composites. The residual surfactant in the BaTiO3/epoxy composites affects the temperature coefficient of capacitance and the peel strength of the epoxy matrix, which in turn affects the temperature coefficient of capacitance and the peel strength of the BaTiO3/epoxy composites.-
dc.languageKorean-
dc.title분산제가 BaTiO3/에폭시 복합체의 유전특성에 미치는 영향-
dc.title.alternativeEffect of surfactant addition on the dielectric properties of BaTIO3/epoxy composites-
dc.typeArticle-
dc.identifier.doi10.3740/MRSK.2009.19.11.576-
dc.description.journalClass1-
dc.identifier.bibliographicCitationKorean Journal of Materials Research, v.19, no.11, pp.576 - 580-
dc.citation.titleKorean Journal of Materials Research-
dc.citation.volume19-
dc.citation.number11-
dc.citation.startPage576-
dc.citation.endPage580-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscopus-
dc.description.journalRegisteredClasskci-
dc.identifier.kciidART001391053-
dc.identifier.scopusid2-s2.0-77949389614-
dc.type.docTypeArticle-
dc.subject.keywordPlusPeel strength-
dc.subject.keywordPlusPromising materials-
dc.subject.keywordPlusTemperature coefficient of capacitance-
dc.subject.keywordPlusCapacitance-
dc.subject.keywordPlusCapacitors-
dc.subject.keywordPlusPermittivity-
dc.subject.keywordPlusPrinted circuit boards-
dc.subject.keywordPlusPrinted circuit manufacture-
dc.subject.keywordPlusSurface active agents-
dc.subject.keywordPlusBarium compounds-
dc.subject.keywordPlusCapacitor dielectrics-
dc.subject.keywordPlusDielectric constants-
dc.subject.keywordPlusEmbedded capacitor-
dc.subject.keywordPlusEpoxy composite-
dc.subject.keywordPlusEpoxy matrices-
dc.subject.keywordAuthorBaTiO3/epoxy composites-
dc.subject.keywordAuthorCapacitor-
dc.subject.keywordAuthorDielectric constant-
dc.subject.keywordAuthorSurfactant-
dc.subject.keywordAuthorTCC-
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KIST Article > 2009
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