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dc.contributor.authorLee, W. J.-
dc.contributor.authorKim, Yoon B.-
dc.date.accessioned2024-01-20T22:05:13Z-
dc.date.available2024-01-20T22:05:13Z-
dc.date.created2021-08-31-
dc.date.issued2008-12-01-
dc.identifier.issn0040-6090-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/132893-
dc.description.abstractIn this study, the adhesion and interface characteristics of NiCr/Cu metal film oil PI film modified by O-2 ion beam were investigated. The surface modification of PI film by O-2 ion beam enabled a significant decrease of contact angles of water from 68 degrees to 4.4 degrees at an ion dose of 1 x 10(18) ions/cm(2), which resulted in an increase of surface energy by a factor of two, The XPS (X-ray Photoelectron Spectroscopy) spectrum showed that the functional groups of C-O and C=O bonding oil PI surface were increased by the interaction between scissored unstable chains and reactive ions. The peel strength between PI and NiCr/Cu metal film increased with all increase of ion dose and the highest peel strength of 0.70 N/mm was obtained at an ion dose of 1 x 10(18) ions/cm(2). According to the XPS depth profile from NiCr metal layer into modified PI film, the O1s peak was broadened at near-interface region with an increase of depth from NiCr layer, which indicates that the new chemical bonding state was formed. In addition to C-O and C=O bonding, the newly formed chemical bonding at the interface between NiCr metal film and PI film was identified as metal-oxide compounds such as NiO, Cr2O3, and Cr-O by XPS curve fitting. Consequently, the improvement of adhesion is primarily attributed to the strong chemical bonding caused by the chemical interaction between NiCr and newly formed functional group by O-2 ion beam. (C) 2008 Elsevier B.V. All rights reserved.-
dc.languageEnglish-
dc.publisherELSEVIER SCIENCE SA-
dc.subjectSURFACE MODIFICATION-
dc.subjectPOLYMER-
dc.subjectPOLYETHYLENE-
dc.subjectPOLYIMIDE-
dc.titleAdhesion and interfacial characteristics of metal/PI composite film modified by O-2 ion beam-
dc.typeArticle-
dc.identifier.doi10.1016/j.tsf.2008.06.022-
dc.description.journalClass1-
dc.identifier.bibliographicCitationTHIN SOLID FILMS, v.517, no.3, pp.1191 - 1194-
dc.citation.titleTHIN SOLID FILMS-
dc.citation.volume517-
dc.citation.number3-
dc.citation.startPage1191-
dc.citation.endPage1194-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.identifier.wosid000262053800037-
dc.identifier.scopusid2-s2.0-56649120575-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryMaterials Science, Coatings & Films-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.relation.journalWebOfScienceCategoryPhysics, Condensed Matter-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaPhysics-
dc.type.docTypeArticle-
dc.subject.keywordPlusSURFACE MODIFICATION-
dc.subject.keywordPlusPOLYMER-
dc.subject.keywordPlusPOLYETHYLENE-
dc.subject.keywordPlusPOLYIMIDE-
dc.subject.keywordAuthorPI film-
dc.subject.keywordAuthorSurface modification-
dc.subject.keywordAuthorAdhesion-
dc.subject.keywordAuthorInterface-
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KIST Article > 2008
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