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dc.contributor.authorKoo, Hyo-Chol-
dc.contributor.authorCho, Sung Ki-
dc.contributor.authorLee, Chang Hwa-
dc.contributor.authorKim, Soo-Kil-
dc.contributor.authorKwon, Oh Joong-
dc.contributor.authorKim, Jae Jeong-
dc.date.accessioned2024-01-20T23:31:16Z-
dc.date.available2024-01-20T23:31:16Z-
dc.date.created2021-09-02-
dc.date.issued2008-05-
dc.identifier.issn0013-4651-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/133539-
dc.description.abstractElectrodeposition of Ag was performed on Ru thin films following electrochemical reduction of native Ru oxide. Oxide reduction in a tetramethylammonium hydroxide solution was critical for the formation of continuous Ag film, and a large overpotential was important for high-density nucleation. From a kinetics viewpoint, the thermal stability of the Ag film was improved by the application of a more negative potential, which suggested that better nucleation density at the initial stage of growth induced better substrate adhesion. Suppression of growth by addition of an organic additive generated a larger and more uniformly distributed initial population of Ag particles, and as a result a smooth film was obtained. (C) 2008 The Electrochemical Society.-
dc.languageEnglish-
dc.publisherELECTROCHEMICAL SOC INC-
dc.subjectDIRECT COPPER ELECTRODEPOSITION-
dc.subjectCHEMICAL-VAPOR-DEPOSITION-
dc.subjectATOMIC LAYER DEPOSITION-
dc.subjectDIFFUSION BARRIER-
dc.subjectCU METALLIZATION-
dc.subjectRUTHENIUM-
dc.subjectNUCLEATION-
dc.subjectGROWTH-
dc.subjectTIN-
dc.subjectADHESION-
dc.titleSilver direct electrodeposition on Ru thin films-
dc.typeArticle-
dc.identifier.doi10.1149/1.2890394-
dc.description.journalClass1-
dc.identifier.bibliographicCitationJOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.155, no.5, pp.D389 - D394-
dc.citation.titleJOURNAL OF THE ELECTROCHEMICAL SOCIETY-
dc.citation.volume155-
dc.citation.number5-
dc.citation.startPageD389-
dc.citation.endPageD394-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.identifier.wosid000254779700039-
dc.identifier.scopusid2-s2.0-41849146799-
dc.relation.journalWebOfScienceCategoryElectrochemistry-
dc.relation.journalWebOfScienceCategoryMaterials Science, Coatings & Films-
dc.relation.journalResearchAreaElectrochemistry-
dc.relation.journalResearchAreaMaterials Science-
dc.type.docTypeArticle-
dc.subject.keywordPlusDIRECT COPPER ELECTRODEPOSITION-
dc.subject.keywordPlusCHEMICAL-VAPOR-DEPOSITION-
dc.subject.keywordPlusATOMIC LAYER DEPOSITION-
dc.subject.keywordPlusDIFFUSION BARRIER-
dc.subject.keywordPlusCU METALLIZATION-
dc.subject.keywordPlusRUTHENIUM-
dc.subject.keywordPlusNUCLEATION-
dc.subject.keywordPlusGROWTH-
dc.subject.keywordPlusTIN-
dc.subject.keywordPlusADHESION-
dc.subject.keywordAuthorAg-
dc.subject.keywordAuthorElectrodeposition-
dc.subject.keywordAuthornucleation-
dc.subject.keywordAuthoradditive-
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