High dielectric constant polyaniline/epoxy composites via in situ polymerization for embedded capacitor applications

Authors
Lu, JiongxinMoon, Kyoung-SikKim, Byung-KookWong, C. P.
Issue Date
2007-03-08
Publisher
ELSEVIER SCI LTD
Citation
POLYMER, v.48, no.6, pp.1510 - 1516
Abstract
Polyaniline (PANI)/epoxy composites with different polyaniline (PANI) contents were successfully developed by in situ polymerization of aniline salt protonated with camphorsulfonic acid within epoxy matrices and fully characterized. The influence of PANI loading levels on various properties was also explored. Dielectric and electrical properties of PANI/epoxy composites were studied for samples in parallel plate configuration. A PANI/epoxy composite prepared in this fashion reached a high dielectric constant close to 3000, a dielectric loss tangent less than 0.5 at room temperature and 10 kHz. The hardener type was also found as a critical parameter for the dielectric properties of PANI/epoxy composites. The distribution of the conductive element clusters within the polymer matrix was studied by SEM and correlated to the dielectric behavior of the composite films. (c) 2007 Elsevier Ltd. All rights reserved.
Keywords
ELECTRICAL-PROPERTIES; BEHAVIOR; MATRIX; RESIN; ELECTRICAL-PROPERTIES; BEHAVIOR; MATRIX; RESIN; high dielectric constant; conductive polymer; in situ polymerization
ISSN
0032-3861
URI
https://pubs.kist.re.kr/handle/201004/134540
DOI
10.1016/j.polymer.2007.01.057
Appears in Collections:
KIST Article > 2007
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