Full metadata record
DC Field | Value | Language |
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dc.contributor.author | Yu, JS | - |
dc.contributor.author | Song, JD | - |
dc.contributor.author | Kim, JM | - |
dc.contributor.author | Lee, YT | - |
dc.contributor.author | Lim, H | - |
dc.date.accessioned | 2024-01-21T07:42:50Z | - |
dc.date.available | 2024-01-21T07:42:50Z | - |
dc.date.created | 2021-09-01 | - |
dc.date.issued | 2004-01 | - |
dc.identifier.issn | 0947-8396 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/137989 | - |
dc.description.abstract | The feasibility of normal GaAs, low-temperature-grown GaAs (LT-GaAs) and low-temperature-grown InGaAs (LT-InGaAs) as the capping layers for impurity-free vacancy disordering (IFVD) of the In0.2Ga0.8As/GaAs multiquantum-well (MQW) structure has been studied. The normal GaAs,LT-GaAs and LT-InGaAs layers were tested as the outermost capping layer and the intermediate cap layer underneath the SiO2 or Si3N4 capping layer. The degree of quantum-well intermixing (QWI) induced by rapid thermal annealing was estimated by the shift of the photoluminescence (PL) peak energy. It was found that the IFVD of the In0.2Ga0.8As/GaAs MQW structure using LT-GaAs (LT-InGaAs) as the outermost capping layer was much smaller ( larger) than that using a SiO2 ( Si3N4) capping layer. It was also observed that the insertion of the normal GaAs, LT-GaAs and LT-InGaAs cap layers below the SiO2 or Si3N4 capping layer reduces the degree of QWI and the PL intensity after the QWI. A plausible explanation for the influence of normal GaAs, LT-GaAs and LT-InGaAs cap layers for the QWI of the InGaAs/GaAs structure is also discussed. | - |
dc.language | English | - |
dc.publisher | SPRINGER-VERLAG | - |
dc.subject | TEMPERATURE-GROWN GAAS | - |
dc.subject | INGAAS/GAAS | - |
dc.subject | HETEROSTRUCTURES | - |
dc.subject | INTERDIFFUSION | - |
dc.subject | LASERS | - |
dc.subject | DEPTH | - |
dc.title | Influence of semiconductor cap layer on the impurity-free vacancy disordering of the In0.2Ga0.8As/GaAs multiquantum-well structure by dielectric capping layers | - |
dc.type | Article | - |
dc.identifier.doi | 10.1007/s00339-002-1900-z | - |
dc.description.journalClass | 1 | - |
dc.identifier.bibliographicCitation | APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, v.78, no.1, pp.113 - 117 | - |
dc.citation.title | APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING | - |
dc.citation.volume | 78 | - |
dc.citation.number | 1 | - |
dc.citation.startPage | 113 | - |
dc.citation.endPage | 117 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.identifier.wosid | 000186497100022 | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.type.docType | Article | - |
dc.subject.keywordPlus | TEMPERATURE-GROWN GAAS | - |
dc.subject.keywordPlus | INGAAS/GAAS | - |
dc.subject.keywordPlus | HETEROSTRUCTURES | - |
dc.subject.keywordPlus | INTERDIFFUSION | - |
dc.subject.keywordPlus | LASERS | - |
dc.subject.keywordPlus | DEPTH | - |
dc.subject.keywordAuthor | InGaAs/GaAs | - |
dc.subject.keywordAuthor | thermal annealing | - |
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