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dc.contributor.authorKARNG SARNG WOO-
dc.contributor.author전진석-
dc.contributor.author곽호영-
dc.date.accessioned2024-02-21T05:07:48Z-
dc.date.available2024-02-21T05:07:48Z-
dc.date.issued1988-11-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/148861-
dc.title전자장치 액침냉각을 위한 마이크로핀에서의 비등열전달에 관한 실험적 연구-
dc.title.alternativeAn experimental study on boiling heat transfer form microfin for immersion cooling of electronic equipments.-
dc.typeBook-
dc.citation.startPage262-
dc.citation.endPage265-
dc.relation.isPartOfSeries대한기계학회 추계학술대회 초록집-
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