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dc.contributor.authorSeo, Jae Eun-
dc.contributor.authorGyeon, Minseung-
dc.contributor.authorSeok, Jisoo-
dc.contributor.authorYoun, Sukhyeong-
dc.contributor.authorDas, Tanmoy-
dc.contributor.authorKwon, Seongdae-
dc.contributor.authorKim, Tae Soo-
dc.contributor.authorLee, Dae Kyu-
dc.contributor.authorKwak, Joon Young-
dc.contributor.authorKang, Kibum-
dc.contributor.authorChang, Jiwon-
dc.date.accessioned2024-08-16T02:30:46Z-
dc.date.available2024-08-16T02:30:46Z-
dc.date.created2024-08-16-
dc.date.issued2024-10-
dc.identifier.issn1616-301X-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/150444-
dc.description.abstractIn this work, the potential of 2D semi-metallic PtSe2 as source/drain (S/D) contacts for 2D material field-effect-transistors (FETs) through theoretical and experimental investigations, is explored. From the density functional theory (DFT) calculations, semi-metallic PtSe2 can inject electrons and holes into MoS2 and WSe2, respectively, indicating the feasibility of PtSe2 contacts for both n- and p-metal-oxide-semiconductor FETs (n-/p-MOSFETs). Indeed, experimentally fabricated flake-level MoS2 n-MOSFETs and WSe2 p-MOSFETs exhibit a significant reduction in contact resistance with semi-metallic PtSe2 contacts compared to conventional Ti/Au contacts. To demonstrate the applicability for large-area electronics, MoS2 n-MOSFETs are fabricated with semi-metallic PtSe2 contacts using chemical vapor deposition-grown MoS2 and PtSe2 films. These devices exhibit outstanding performance metrics, including high on-state current (approximate to 10(-7) A/mu m) and large on/off ratio (>10(7)). Furthermore, by employing these high-performance MoS2 n-MOSFETs, vertically stacked n-MOS inverters are successfully demonstrated, suggesting that 3D integration of 2D material FETs is possible using semi-metallic PtSe2 contacts.-
dc.languageEnglish-
dc.publisherJohn Wiley & Sons Ltd.-
dc.titleImprovement of Contact Resistance and 3D Integration of 2D Material Field-Effect Transistors Using Semi-Metallic PtSe2 Contacts-
dc.typeArticle-
dc.identifier.doi10.1002/adfm.202407382-
dc.description.journalClass1-
dc.identifier.bibliographicCitationAdvanced Functional Materials, v.34, no.44-
dc.citation.titleAdvanced Functional Materials-
dc.citation.volume34-
dc.citation.number44-
dc.description.isOpenAccessY-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.identifier.scopusid2-s2.0-85200122388-
dc.relation.journalWebOfScienceCategoryChemistry, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryChemistry, Physical-
dc.relation.journalWebOfScienceCategoryNanoscience & Nanotechnology-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.relation.journalWebOfScienceCategoryPhysics, Condensed Matter-
dc.relation.journalResearchAreaChemistry-
dc.relation.journalResearchAreaScience & Technology - Other Topics-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaPhysics-
dc.type.docTypeArticle; Early Access-
dc.subject.keywordPlusMOS2 TRANSISTORS-
dc.subject.keywordPlusHIGH-PERFORMANCE-
dc.subject.keywordPlusMONOLAYER PTSE2-
dc.subject.keywordPlusSTABILITY-
dc.subject.keywordPlusPROSPECTS-
dc.subject.keywordPlusDEFECTS-
dc.subject.keywordAuthor2D material-
dc.subject.keywordAuthor3D integration-
dc.subject.keywordAuthorcontact resistance-
dc.subject.keywordAuthorn-MOS inverter-
dc.subject.keywordAuthorPtSe2-
dc.subject.keywordAuthorvertical stacking-
dc.subject.keywordAuthory-function method (YFM)-
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