Fourier Surfaces Reaching Full-Color Diffraction Limits

Abstract

Optical Fourier surfaces (OFSs), characterized by sinusoidally profiled diffractive optical elements, can outperform traditional binary-type counterparts by minimizing optical noise through selectively driving diffraction at desired frequencies. While scanning probe lithography (SPL), gray-scale electron beam lithography (EBL), and holographic inscriptions are effective for fabricating OFSs, achieving full-color diffractions at fundamental efficiency limits is challenging. Here, an integrated manufacturing process is presented, validated theoretically and experimentally, for fully transparent OFSs reaching the fundamental limit of diffraction efficiency. Leveraging holographic inscriptions and soft nanoimprinting, this approach effectively addresses challenges in conventional OFS manufacturing, enabling scalable production of noise-free and maximally efficient OFSs with record-high throughput (1010-1012 mu m2 h-1), surpassing SPL and EBL by 1010 times. Toward this end, a wafer-scale OFSs array is demonstrated consisting of full-color diffractive gratings, color graphics, and microlenses by the one-step nanoimprinting, which is readily compatible with rapid prototyping of OFSs even on curved panels, demanding for transformative optical devices such as augmented and virtual reality displays. The rising demand for transformative optical devices derives the importance of optical Fourier surfaces (OFSs) minimizing optical loss of diffraction. To address the current challenges of OFSs regarding scalability and full-color diffraction, an integrative manufacturing strategy is presented for the first realization of scalable and fully transparent OFSs reaching the fundamental diffraction limits at the full-visible regimes. image