Full metadata record

DC Field Value Language
dc.contributor.authorJang, Han Gyeol-
dc.contributor.authorLim, Deok Jae-
dc.contributor.authorAn, So Hyun-
dc.contributor.authorPark, Jong Hyuk-
dc.contributor.authorPark, Min-
dc.contributor.authorPark, Jinwoo-
dc.contributor.authorPark, Hyungbum-
dc.contributor.authorKim, Byeong-Su-
dc.contributor.authorLee, Doh C.-
dc.contributor.authorKim, Jaewoo-
dc.date.accessioned2024-11-07T11:00:23Z-
dc.date.available2024-11-07T11:00:23Z-
dc.date.created2024-11-07-
dc.date.issued2024-11-
dc.identifier.issn1385-8947-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/151007-
dc.description.abstractThe increasing demand for one-component epoxy is driven by its eco-friendliness, convenience, and cost-effectiveness, underscoring the importance of developing latent curing agents that trigger reactions under specific conditions. This study introduces an imidazole-based latent curing agent (ICM-SU) characterized by superior storage stability and low-temperature curing capabilities, achieved through dual protections of chemical capping and mechano-chemical capsuling. The process commences with the synthesis of isophorone diisocyanate capped 2-methylimidazole (ICM), wherein the reactivity of 2-methylimidazole (2MI) is controlled via the inductive effect of isophorone diisocyanate, achieved through chemical capping. Subsequently, ICM-SU is produced by uniformly coating it with silica nanoparticles and a urea shell through mechano-fusion system’s dry processing for mechano-chemical capsuling, effectively isolating it from contact with epoxy. The curing mechanism and chemical structure of ICM-SU are identified in four stages: de-capping, de-shelling, formation of epoxy-imidazole adducts, and chain growth. Notably, the melting point of the urea shell (122 °C) closely matches the curing onset temperature, suggesting that the exposure of epoxy to restored 2MI initiates the curing process. As a result, ICM-SU demonstrates significantly enhances storage stability at 20 °C for over 42 days, a stark improvement over 2MI, which solidifies within 8 h. Moreover, specimens cured with ICM-SU exhibits a 32 % increase in tensile strength and a 25 % improvement in Young’s modulus compared to those cured with 2MI, attributed to the reinforcing filler effect of silica nanoparticles.-
dc.languageEnglish-
dc.publisherElsevier BV-
dc.titleExploring synthesis techniques for an imidazole-based one-component epoxy latent curing agent: Chemical capping and mechano-chemical capsuling-
dc.typeArticle-
dc.identifier.doi10.1016/j.cej.2024.157368-
dc.description.journalClass1-
dc.identifier.bibliographicCitationChemical Engineering Journal, v.500-
dc.citation.titleChemical Engineering Journal-
dc.citation.volume500-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
Appears in Collections:
KIST Article > 2024
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML

qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE