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dc.contributor.authorJang, Han Gyeol-
dc.contributor.authorLim, Deok Jae-
dc.contributor.authorAn So Hyun-
dc.contributor.authorPark, Jong Hyuk-
dc.contributor.authorPark, Min-
dc.contributor.authorDoh Chang Lee-
dc.contributor.authorKim, Jaewoo-
dc.date.accessioned2024-01-12T02:44:45Z-
dc.date.available2024-01-12T02:44:45Z-
dc.date.created2023-11-06-
dc.date.issued2023-10-12-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/76364-
dc.description.abstractOne-part epoxy is a form where resin and curing agent are pre-mixed, and it is widely used in various fields such as electronic packages, adhesives, coatings, solders, resist inks, and composites due to its convenience and consistent performance. However, one-part epoxy easily reacts during storage due to the reactivity of curing agent, which necessitates providing long-term stability, i.e., latent properties. Current methods for enhancing long-term stability are mostly rely on wet processes, showing economically- and environmentally-unfriendly issues. Herein, unlike conventional wet processes, latent curing agents were developed through a dry encapsulation process. In the 1st step, imidazole was transformed into an adduct through a chemical reaction, and in the 2nd step, a dry encapsulation process coated the silica/urea layer. The synthesized latent curing agent was evaluated for its physical/thermal/mechanical properties using FT-IR, NMR, SEM, DSC, TGA, UTM, and viscometer.-
dc.languageEnglish-
dc.publisher한국고분자학회 (The Polymer Society of Korea)-
dc.titleDevelopment of imidazole-based latent curing agent via mechanochemical encapsulation-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation2023 한국고분자학회 추계 총회 및 학술대회-
dc.citation.title2023 한국고분자학회 추계 총회 및 학술대회-
dc.citation.conferencePlaceKO-
dc.citation.conferencePlace제주국제컨벤션센터 (ICC)-
dc.citation.conferenceDate2023-10-11-
dc.relation.isPartOf한국고분자학회 2023년도 추계 정기총회 및 학술대회-
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