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dc.contributor.authorJang, Han Gyeol-
dc.contributor.authorLim, Deok Jae-
dc.contributor.authorKim Hae Na-
dc.contributor.authorAn So Hyun-
dc.contributor.authorPark, Jong Hyuk-
dc.contributor.authorPark, Min-
dc.contributor.authorLee, Doh Chang-
dc.contributor.authorKim, Jaewoo-
dc.date.accessioned2024-01-12T02:46:33Z-
dc.date.available2024-01-12T02:46:33Z-
dc.date.created2023-11-06-
dc.date.issued2023-05-12-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/76456-
dc.description.abstractEpoxy is widely utilized in various applications such as electronic packaging adhesives, solder resist ink, powder coating, composite materials, due to its excellent properties. It’s composed of resin and curing agent, and can be classified into one or two part types by pre-mixing or not. One part epoxy is economically and environmentally friendly due to stable performance and reduced working time,. Unfortunately, its outstanding curing tendency can lead to low storage stability. In this study, we developed a novel latent curing agent with remarkable storage stability and rapid curing reaction. Through mechanofusion by dry encapsulation, we synthesized end-capped imidazole-based curing agents, and evaluated the synthesis, morphology, curing behavior and storage stability using FT-IR, NMR, SEM, DSC and rotational viscometer. As the results are a peak temperature of 134 ℃ and 30 days of RT stability, confirmed to be improved overall storage stability and curing behaviors.-
dc.languageEnglish-
dc.publisher한국공업화학회-
dc.titleDevelopment of imidazole-based latent curing agent via mechanochemical encapsulation-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation2023 한국공업화학회 춘계 총회 및 학술대회-
dc.citation.title2023 한국공업화학회 춘계 총회 및 학술대회-
dc.citation.conferencePlaceKO-
dc.citation.conferencePlace제주국제컨벤션센터 (ICC)-
dc.citation.conferenceDate2023-05-10-
dc.relation.isPartOf2023 한국공업화학회 춘계 총회 및 학술대회-
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