DSpace at KISTKIST Conference Paper2019

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dc.contributor.authorLee Bora-
dc.contributor.authorHo Sun Lim-
dc.contributor.author한호규-
dc.contributor.authorDoh Jung Mann-
dc.contributor.authorCheolmin Park-
dc.contributor.authorJung Ah Lim-
dc.date.accessioned2024-01-12T05:38:25Z-
dc.date.available2024-01-12T05:38:25Z-
dc.date.created2021-09-29-
dc.date.issued2019-06-
dc.identifier.issn--
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/78848-
dc.languageEnglish-
dc.publisher한국전기전자재료학회-
dc.titleEco-friendly and super durable conducting paste with high adhesion strength and hardness based on natural lacquer sap-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation2019 한국전기전자재료학회 하계학술대회-
dc.citation.title2019 한국전기전자재료학회 하계학술대회-
dc.citation.conferencePlaceKO-
dc.citation.conferencePlace횡성-
dc.citation.conferenceDate2019-06-19-
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KIST Conference Paper > 2019
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