Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Seonho Seok | - |
dc.contributor.author | HyungDal Park | - |
dc.contributor.author | Wonsuk Choi | - |
dc.contributor.author | Kim, Ock chul | - |
dc.contributor.author | KIM, JINSEOK | - |
dc.date.accessioned | 2024-01-12T05:39:22Z | - |
dc.date.available | 2024-01-12T05:39:22Z | - |
dc.date.created | 2021-09-29 | - |
dc.date.issued | 2019-05 | - |
dc.identifier.issn | - | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/78893 | - |
dc.description.abstract | This paper presents an FEM analysis and experiment of parylene-metal-parylene flexible substrate for implantable medical devices. Tensile strength measurement of the parylene-metal-parylene has been carried out and corresponding FEM modeling and simulation has been done to understand its mechanical behaviour. Besides, frequently encountered metal delamination on parylene substrate has been studied based on cohesive zone model of interface between the two materials. | - |
dc.language | English | - |
dc.publisher | IEEE | - |
dc.subject | FEM (Finite Element Method) | - |
dc.subject | Parylene | - |
dc.subject | Neural Probe | - |
dc.subject | Implantable | - |
dc.title | Analysis of Thin Film Parylene-Metal-Parylene Device Based on Mechanical Tensile Strength Measurement | - |
dc.type | Conference | - |
dc.description.journalClass | 1 | - |
dc.identifier.bibliographicCitation | 21st Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS (DTIP) | - |
dc.citation.title | 21st Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS (DTIP) | - |
dc.citation.conferencePlace | FR | - |
dc.citation.conferencePlace | Paris, France | - |
dc.citation.conferenceDate | 2019-05-12 | - |
dc.relation.isPartOf | SYMPOSIUM ON DESIGN, TEST, INTEGRATION & PACKAGING OF MEMS AND MOEMS (DTIP 2019) | - |
dc.identifier.wosid | 000490876100014 | - |
dc.identifier.scopusid | 2-s2.0-85069444808 | - |
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