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dc.contributor.authorSeonho Seok-
dc.contributor.authorHyungDal Park-
dc.contributor.authorWonsuk Choi-
dc.contributor.authorKim, Ock chul-
dc.contributor.authorKIM, JINSEOK-
dc.date.accessioned2024-01-12T05:39:22Z-
dc.date.available2024-01-12T05:39:22Z-
dc.date.created2021-09-29-
dc.date.issued2019-05-
dc.identifier.issn--
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/78893-
dc.description.abstractThis paper presents an FEM analysis and experiment of parylene-metal-parylene flexible substrate for implantable medical devices. Tensile strength measurement of the parylene-metal-parylene has been carried out and corresponding FEM modeling and simulation has been done to understand its mechanical behaviour. Besides, frequently encountered metal delamination on parylene substrate has been studied based on cohesive zone model of interface between the two materials.-
dc.languageEnglish-
dc.publisherIEEE-
dc.subjectFEM (Finite Element Method)-
dc.subjectParylene-
dc.subjectNeural Probe-
dc.subjectImplantable-
dc.titleAnalysis of Thin Film Parylene-Metal-Parylene Device Based on Mechanical Tensile Strength Measurement-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitation21st Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS (DTIP)-
dc.citation.title21st Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS (DTIP)-
dc.citation.conferencePlaceFR-
dc.citation.conferencePlaceParis, France-
dc.citation.conferenceDate2019-05-12-
dc.relation.isPartOfSYMPOSIUM ON DESIGN, TEST, INTEGRATION & PACKAGING OF MEMS AND MOEMS (DTIP 2019)-
dc.identifier.wosid000490876100014-
dc.identifier.scopusid2-s2.0-85069444808-
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KIST Conference Paper > 2019
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