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dc.contributor.authorLee Jang Geon-
dc.contributor.authorShin Haeun-
dc.contributor.authorPark Chan Hee-
dc.contributor.authorKim Chae Bin-
dc.contributor.authorGoh Munju-
dc.date.accessioned2024-01-12T05:40:06Z-
dc.date.available2024-01-12T05:40:06Z-
dc.date.created2021-09-29-
dc.date.issued2019-04-11-
dc.identifier.issn--
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/78929-
dc.languageEnglish-
dc.publisher한국고분자학회-
dc.titleOptimizing Filler Network Formation in Polymer Composites for Packaging Material with High Thermal Conductivity-
dc.title.alternative높은 열전도도를 갖는 패키징 재료용 고분자 복합재료의 필러 네트워크 형성 최적화-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation2019년 한국고분자학회 춘계학술대회-
dc.citation.title2019년 한국고분자학회 춘계학술대회-
dc.citation.conferencePlaceKO-
dc.citation.conferencePlace부산컨벤션센터(BEXCO)-
dc.citation.conferenceDate2019-04-10-
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KIST Conference Paper > 2019
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