Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 최원국 | - |
dc.contributor.author | 박동희 | - |
dc.contributor.author | 최형욱 | - |
dc.date.accessioned | 2024-01-12T07:42:33Z | - |
dc.date.available | 2024-01-12T07:42:33Z | - |
dc.date.issued | 2010-03-15 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/81194 | - |
dc.title | 고밀착력 무접착제 연성 회로기판 및 이의 연속적 제작 방법 | - |
dc.type | Patent | - |
dc.date.registration | 2010-03-15 | - |
dc.date.application | 2007-12-20 | - |
dc.identifier.patentRegistrationNumber | 10-0948859 | - |
dc.identifier.patentApplicationNumber | 2007-134160 | - |
dc.publisher.country | KO | - |
dc.type.iprs | 특허 | - |
dc.contributor.assignee | 한국과학기술연구원 | - |
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