DSpace at KISTKIST Conference Paper2008

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dc.contributor.authorKim, Seong Yun-
dc.date.accessioned2024-01-12T07:51:48Z-
dc.date.available2024-01-12T07:51:48Z-
dc.date.created2022-01-14-
dc.date.issued2008-02-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/81382-
dc.languageEnglish-
dc.publisher한국유변학회-
dc.titleDevelopment of Thermal Residual Stresses and Warpage in Film insert molded Parts-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation2008 Proceedings of The 8th Annual Meeting of the Applied Rheology Center, pp.31 - 34-
dc.citation.title2008 Proceedings of The 8th Annual Meeting of the Applied Rheology Center-
dc.citation.startPage31-
dc.citation.endPage34-
dc.citation.conferencePlaceKO-
dc.citation.conferenceDate2008-02-12-
dc.relation.isPartOfProceedings of The 8th Annual Meeting of the Applied Rheology Center-
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