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dc.contributor.authorKarng, Sarng Woo-
dc.contributor.authorJi, Tae Ho-
dc.contributor.authorKim, Seo Young-
dc.date.accessioned2024-01-12T08:14:35Z-
dc.date.available2024-01-12T08:14:35Z-
dc.date.created2022-03-07-
dc.date.issued2006-05-
dc.identifier.issn0000-0000-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/81920-
dc.description.abstractIn the present study, the boiling of FC-72 occurs from a smooth boiling surface (14 × 14 mm2) and its vapor is condensed by four different types of condensing surfaces (30 × 30 mm2 base): a smooth surface and 1 × 1 mm2 pinfinned surfaces of 2 mm high with 0.3 mm, 0.5 mm, and 1 mm array spacing. Boiling characteristics are investigated in detail for different condensing surfaces. For a smooth boiling surface, the results obtained display that the pin-finned condensing surface with 1 mm array spacing yields the best performance and the smooth condensing surface does the worst. Furthermore hysteresis phenomenon is substantially reduced by using the enhanced condensing surfaces. ? 2006 IEEE.-
dc.languageEnglish-
dc.publisherIEEE-
dc.titleEffects of pin-finned condensing surfaces on pool boiling in FC-72-
dc.typeConference-
dc.identifier.doi10.1109/ITHERM.2006.1645398-
dc.description.journalClass1-
dc.identifier.bibliographicCitation10th Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006, pp.586 - 590-
dc.citation.title10th Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006-
dc.citation.startPage586-
dc.citation.endPage590-
dc.citation.conferencePlaceUS-
dc.citation.conferencePlaceSan Diego, CA-
dc.citation.conferenceDate2006-05-30-
dc.relation.isPartOfThermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference-
dc.identifier.scopusid2-s2.0-33845569379-
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KIST Conference Paper > 2006
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