Full metadata record
DC Field | Value | Language |
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dc.contributor.author | Karng, Sarng Woo | - |
dc.contributor.author | Ji, Tae Ho | - |
dc.contributor.author | Kim, Seo Young | - |
dc.date.accessioned | 2024-01-12T08:14:35Z | - |
dc.date.available | 2024-01-12T08:14:35Z | - |
dc.date.created | 2022-03-07 | - |
dc.date.issued | 2006-05 | - |
dc.identifier.issn | 0000-0000 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/81920 | - |
dc.description.abstract | In the present study, the boiling of FC-72 occurs from a smooth boiling surface (14 × 14 mm2) and its vapor is condensed by four different types of condensing surfaces (30 × 30 mm2 base): a smooth surface and 1 × 1 mm2 pinfinned surfaces of 2 mm high with 0.3 mm, 0.5 mm, and 1 mm array spacing. Boiling characteristics are investigated in detail for different condensing surfaces. For a smooth boiling surface, the results obtained display that the pin-finned condensing surface with 1 mm array spacing yields the best performance and the smooth condensing surface does the worst. Furthermore hysteresis phenomenon is substantially reduced by using the enhanced condensing surfaces. ? 2006 IEEE. | - |
dc.language | English | - |
dc.publisher | IEEE | - |
dc.title | Effects of pin-finned condensing surfaces on pool boiling in FC-72 | - |
dc.type | Conference | - |
dc.identifier.doi | 10.1109/ITHERM.2006.1645398 | - |
dc.description.journalClass | 1 | - |
dc.identifier.bibliographicCitation | 10th Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006, pp.586 - 590 | - |
dc.citation.title | 10th Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006 | - |
dc.citation.startPage | 586 | - |
dc.citation.endPage | 590 | - |
dc.citation.conferencePlace | US | - |
dc.citation.conferencePlace | San Diego, CA | - |
dc.citation.conferenceDate | 2006-05-30 | - |
dc.relation.isPartOf | Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference | - |
dc.identifier.scopusid | 2-s2.0-33845569379 | - |
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