Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Yong Tae | - |
| dc.date.accessioned | 2024-01-12T10:41:21Z | - |
| dc.date.available | 2024-01-12T10:41:21Z | - |
| dc.date.created | 2022-01-14 | - |
| dc.date.issued | 1999-05-18 | - |
| dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/84919 | - |
| dc.title | Effects of PECVD W-N diffusion barrier on thermal stress and electrical properties of Cu/W-N/SiOF multilevel interconnect | - |
| dc.type | Conference | - |
| dc.description.journalClass | 1 | - |
| dc.identifier.bibliographicCitation | , pp.0 | - |
| dc.citation.startPage | 0 | - |
| dc.citation.endPage | 0 | - |
| dc.relation.isPartOf | The EOS/SPIE Symp. on Microelectronics Manufacturing Technologies | - |
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