Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | CHOI, WON KOOK | - |
| dc.date.accessioned | 2024-01-12T11:09:56Z | - |
| dc.date.available | 2024-01-12T11:09:56Z | - |
| dc.date.created | 2022-01-14 | - |
| dc.date.issued | 1998-04-01 | - |
| dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/85422 | - |
| dc.title | 이온보조 반응법을 이용한 금속과 고분자의 접착력 향상에 관한 연구 | - |
| dc.type | Conference | - |
| dc.description.journalClass | 2 | - |
| dc.identifier.bibliographicCitation | 한국패키징학회, pp.41 - 52 | - |
| dc.citation.title | 한국패키징학회 | - |
| dc.citation.startPage | 41 | - |
| dc.citation.endPage | 52 | - |
| dc.relation.isPartOf | Proceedings of 4th International Symposim on Microelectronics and Packaging | - |
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