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dc.contributor.authorJeong, Jeung hyun-
dc.date.accessioned2024-01-12T11:39:26Z-
dc.date.available2024-01-12T11:39:26Z-
dc.date.created2022-01-14-
dc.date.issued1996-01-01-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/85945-
dc.titleDetermination of adhesion strength of hard thin film on ductile substrate through film cracking technique-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitation, pp.573 - 578-
dc.citation.startPage573-
dc.citation.endPage578-
dc.relation.isPartOfAsian Pacific Conference for Fracture and Strength 96-
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