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dc.contributor.authorKim youngsu-
dc.contributor.authorKim Chae Bin-
dc.contributor.authorLee Seung-Hee-
dc.contributor.authorGoh Munju-
dc.date.accessioned2024-01-12T13:08:47Z-
dc.date.available2024-01-12T13:08:47Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/87615-
dc.languageEnglish-
dc.publisher11.8~10, 부산-
dc.subject액정성에폭시-
dc.subject합성-
dc.subject열전도도-
dc.subject복합재료-
dc.titleLiquid Crystalline Epoxy Resin/Alumina Composites for Highly Thermal Conducting Circuit Board-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation한국공업화학회 2017 추계 학술대회-
dc.citation.title한국공업화학회 2017 추계 학술대회-
dc.citation.conferencePlaceKO-
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