Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Yong Tae | - |
| dc.contributor.author | Kim, Young-Hwan | - |
| dc.date.accessioned | 2024-01-12T16:06:35Z | - |
| dc.date.available | 2024-01-12T16:06:35Z | - |
| dc.date.created | 2021-09-29 | - |
| dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/91242 | - |
| dc.language | English | - |
| dc.title | Low Stress C-doped Tungsten Nitride Diffusion Barrier for Cu Interconnection | - |
| dc.type | Conference | - |
| dc.description.journalClass | 1 | - |
| dc.identifier.bibliographicCitation | E-MRS | - |
| dc.citation.title | E-MRS | - |
| dc.citation.conferencePlace | FR | - |
- Appears in Collections:
- KIST Conference Paper > Others
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