Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 주병권 | - |
dc.contributor.author | 오명환 | - |
dc.contributor.author | 최우범 | - |
dc.contributor.author | 정지원 | - |
dc.date.accessioned | 2024-01-12T16:30:27Z | - |
dc.date.available | 2024-01-12T16:30:27Z | - |
dc.date.issued | 2001-01-11 | - |
dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/91287 | - |
dc.title | 반도체 기판의 정전 열 접합방법 | - |
dc.type | Patent | - |
dc.date.registration | 2001-01-11 | - |
dc.date.application | 1997-09-11 | - |
dc.identifier.patentRegistrationNumber | 286252 | - |
dc.identifier.patentApplicationNumber | 97-46678 | - |
dc.publisher.country | KO | - |
dc.type.iprs | 특허 | - |
dc.contributor.assignee | 한국과학기술연구원 | - |
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