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dc.contributor.author백승협-
dc.contributor.author영서광-
dc.contributor.author한재훈-
dc.contributor.author이병철-
dc.contributor.author김진상-
dc.contributor.author송현철-
dc.contributor.author김성근-
dc.contributor.author강종윤-
dc.contributor.author최지원-
dc.contributor.author윤정호-
dc.date.accessioned2024-01-12T16:31:41Z-
dc.date.available2024-01-12T16:31:41Z-
dc.date.issued2023-10-12-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/91400-
dc.title이종 접합 반도체 기판, 그의 제조방법 및 그를 이용한 전자소자-
dc.typePatent-
dc.date.registration2023-10-12-
dc.date.application2021-07-06-
dc.identifier.patentRegistrationNumber10-2590568-
dc.identifier.patentApplicationNumber10-2021-0088485-
dc.publisher.countryKO-
dc.type.iprs특허-
dc.contributor.assignee한국과학기술연구원-
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KIST Patent > 2021
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