DSpace at KISTKIST Patent2018

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dc.contributor.author최지원-
dc.contributor.author김진상-
dc.contributor.author강종윤-
dc.contributor.author김성근-
dc.contributor.author이영신-
dc.contributor.author김상태-
dc.contributor.author이원재-
dc.contributor.author나렌드라 싱-
dc.contributor.author백승협-
dc.date.accessioned2024-01-12T17:01:21Z-
dc.date.available2024-01-12T17:01:21Z-
dc.date.issued2020-06-16-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/91936-
dc.titlep형 반도체의 오믹 접촉을 위한 바인더가 첨가된 MoO2와 ReO2 페이스트 및 공정-
dc.typePatent-
dc.date.registration2020-06-16-
dc.date.application2018-05-29-
dc.identifier.patentRegistrationNumber10685762-
dc.identifier.patentApplicationNumber15/990824-
dc.publisher.countryUS-
dc.type.iprs특허-
dc.contributor.assignee한국과학기술연구원-
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KIST Patent > 2018
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