1995-01 | New concept for amorphous diffusion barrier: Ion beam modification of metal/semiconductor interface. | Kim Yong Tae; S. K. Kwak; C. S. Kwon; D. J. Kim; C. W. Lee; I. H. Choi; Min Suk-Ki |
1993-01 | Effects of nitrogen on the stress of plasma deposited tungsten and tungsten nitride thin films. | Kim Yong Tae; S. J. Lee; C. S. Kwon; Y. W. Park; C. C. Lee; C. W. Lee; Min Suk-Ki |
1993-01 | Atomic force microscopic observation in the surface morphologies and roughness of plasma deposited tungsten and tungsten nitride thin films. | Kim Yong Tae; C. S. Kwon; I. H. Choi; C. W. Lee; Min Suk-Ki |
1996-01 | Nitrogen effects of Ta-Si-N diffusion barrier in Si/Cu metallization. | Kim Yong Tae; S. P. Jeong; D. J. Kim; J. W. Park; Min Suk-Ki |
1996-01 | Study of temperature dependent conductivity of Ta, Ta-Si-N thin films. | Kim Yong Tae; S. P. Jeong; D. J. Kim; H. N. Lee; Min Suk-Ki |
1994-01 | Comparison of high temperature thermal stability of Ru and RuO//2 schottky contact to GaAs. | Kim Yong Tae; S. K. Kwak; C. W. Lee; J. G. Lee; C. S. Kwon; K. S. Jung; Min Suk-Ki |
1994-01 | Post annealing characteristics of RF magnetron sputtered PbTiO//3 films. | Kim Yong Tae; H. N. Lee; J. G. Lee; C. S. Kwon; S. H. Choh; Min Suk-Ki |
1994-01 | Characteristics of RF magnetron sputtered (Ba, Sr)TiO//3 thin films on RuO//2 bottom electrode. | Kim Yong Tae; J. G. Lee; H. N. Lee; C. S. Kwon; S. H. Choh; Min Suk-Ki |
1993-01 | Comparison of plasma deposited tungsten and tungsten nitride schottky contacts to GaAs. | Kim Yong Tae; S. J. Lee; C. S. Kwon; C. W. Lee; Min Suk-Ki |
1994-01 | Nitrogen implanted tungsten thin films for Cu diffusion barrier. | Kim Yong Tae; D. J. Kim; C. S. Kwon; I. H. Choi; Min Suk-Ki |