Showing results 3 to 4 of 4
Issue Date | Title | Author(s) |
---|---|---|
1997-04-15 | Implementation of vector moving Preisach model using texture coefficients as easy axis distribution | Seol, SC; Kang, T; Shin, KH; Lee, TD; Park, GS |
2005-08 | Low-temperature silicon wafer-scale thermocompression bonding using electroplated gold layers in hermetic packaging | Park, GS; Kim, YK; Paek, KK; Kim, JS; Lee, JH; Ju, BK |