| 2001-03 | Microtunneling sensors for vacuum level evaluation of field emission display devices | Park, HW; Ju, BK; Park, YK; Lee, DJ; Lee, YH; Kim, CJ; Park, JH; Oh, MH |
| 2001-07 | New plasma display panel packaging technology using electrostatic bonding method | Lee, DJ; Jeong, JW; Kim, YC; Lee, YH; Ju, BK; Cho, TS; Choi, EH; Jang, J |
| 1999-01 | Novel bonding technology for hermetically sealed silicon micropackage | Lee, DJ; Ju, BK; Choi, WB; Jeong, JW; Lee, YH; Jang, J; Lee, KB; Oh, MH |
| 1998-11-11 | The analysis of electric properties of thin film composite reverse osmosis membrane with wet impedance method | Lee, DJ; Choi, YK; Lee, SB; Ahn, KH; Min, BR |
| 2004-05-03 | The vacuum packaging of a flat lamp using thermally grown carbon nano tubes | Lee, DJ; Moon, SI; Lee, YH; Yoo, JE; Park, JH; Jang, J; Ju, BK |
| 2004-05 | Thin AC-PDP vacuum in-line sealing using direct-joint packaging method | Lee, DJ; Moon, SI; Lee, YH; Ju, BK |
| 1999 | Vacuum packaging using anodic bonding and emission characteristics of FED | Lee, DJ; Ju, BK; Jeong, JW; Kim, H; Jung, SJ; Jang, J; Oh, MH |
