Vacuum packaging using anodic bonding and emission characteristics of FED

Abstract

In this paper, we suggest the FED packaging technology using anodic bonding method. Amorphous silicon film deposited on glass was contacted with glass substrate followed by bonded. Glass-glass bonding is based on conventional silicon-glass bonding mechanism and achieved successfully. The FED panel having opened exhausting hole was formed by glass frit process and sealed by capping glass. From the leak test in a bonded interface, the inner pressure of panel was kept continuously during pumping out. A light emission was observed from the packaged 0.7-inch FED, then anode current was 34 mu A. Emission stability was constantly measured for 11 hours.