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Showing results 17 to 23 of 23

Issue DateTitleAuthor(s)
2002-11Metalorganic atomic layer deposition of TiN thin films using TDMAT and NH3Kim, HK; Kim, JY; Park, JY; Kim, Y; Kim, YD; Jeon, H; Kim, WM
1997-05Mo- 화합물의 확산방지막으로서의 성질에 관한 연구김지형; 이용혁; 권용성; 염근영; 송종한
1997-11-15Nanostructured Ta-Si-N diffusion barriers for Cu metallizationKim, DJ; Kim, YT; Park, JW
1999-07New method to prepare W-B+-N ternary barrier to Cu diffusion by implanting BF2+ ions into W-N thin filmKim, DJ; Kim, YT; Park, JW
1998-01RF power dependence of stresses in plasma deposited low resistive tungsten films for VLSI devices이창우; 고민경; 오환원; 우상록; 윤성로; 김용태; 박영균; 고석중
-Stress evolution and diffusion barrier performance of La0.67Sr0.33MnO3 (LSMO)/WCN/Si structureChang Woo Lee; Kim, Yong Tae; Akihiro Wakahara; KIM Hee Joon
2000-09Thermal stability of tungsten-boron-nitride thin film as diffusion barrierPark, YK; Kim, SI; Kim, YT; Lee, CW
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