Browsing byAuthorKim, Heesuk
Showing results 78 to 99 of 99
| Issue Date | Title | Author(s) |
|---|---|---|
| 2009-04 | Organic/inorganic interfaces and their applications | Kim, Heesuk |
| 2009-04 | Organic/inorganic interfaces and their applications | Kim, Heesuk |
| 2012-08-21 | Photochemical Grafting of Organic Alkenes to Single-Crystal TiO2 Surfaces: A Mechanistic Study | Franking, Ryan; Kim, Heesuk; Chambers, Scott A.; Mangham, Andrew N.; Hamers, Robert J. |
| 2012-12-01 | Preparation of poly(methyl methacrylate)/clay nanocomposites using supercritical fluid process | Jung, Hyun Taek; Lee, Sang-Soo; Park, Min; Kim, Heesuk; Lim, Soonho |
| - | Preparation of TiO2 nanoparticles modified with organic layers as additives of oligomer electrolyte in DSSC | Kim Chul Ki; Kim, Ilwon; Lee, Hyunjung; Lee, Sang-Soo; Kim, Jun Kyung; Kim, Heesuk |
| - | Rational design of nanocarbon/Te nanowire composites for flexible and stable thermoelectric materials | Kim, Heesuk; Lee, Sang-Soo; Lee Jang-Yeol; Jaeyoo Choi |
| 2015-11-10 | Remarkable Conversion Between n- and p-Type Reduced Graphene Oxide on Varying the Thermal Annealing Temperature | Nguyen Dien Kha Tu; Choi, Jaeyoo; Park, Chong Rae; Kim, Heesuk |
| 2023-04 | Selective Dissolution-Derived Nanoporous Design of Impurity-Free Bi2Te3 Alloys with High Thermoelectric Performance | Lee, seung hyeok; Jung, Sung jin; Park, Gwang Min; Minyoung Na; Kim, Kwang-Chon; Hong Junpyo; Lee, Albert S. S.; BAEK, SEUNG HYUB; Kim, Heesuk; Park, Tae Joo; Kim, Jin-Sang; Kim, Seong Keun |
| 2017-05 | Significantly reduced thermal conductivity and enhanced thermoelectric properties of single- and bi-layer graphene nanomeshes with sub-10 nm neck-width | Oh, Jinwoo; Yoo, Hoyeon; Choi, Jaeyoo; Kim, Jeong Yun; Lee, Dong Su; Kim, Myung Jong; Lee, Jong-Chan; Kim, Woo Nyon; Grossman, Jeffrey C.; Park, Jong Hyuk; Lee, Sang-Soo; Kim, Heesuk; Son, Jeong Gon |
| - | Simple preparation of boron-substituted and reduced graphene oxide by thermal annealing and its electrical properties | Kim, Heesuk; Woojin Jeon; Yeom Da-young; Lee, Sang-Soo; 성봉준 |
| 2017-08-20 | Stretchable conductive adhesives based on silver/silicone rubber nanocomposites | Miju, Jung; Huh, Wansoo; Kim, Heesuk |
| 2019-10-09 | Stretchable Conductive Adhesives with Superior Electrical Stability as Printable Interconnects in Washable Textile Electronics | Ko, Youngpyo; Oh, Jinwoo; Park, Kyung Tae; Kim, Soojin; Huh, Wansoo; Sung, Bong June; Lim, Jung Ah; Lee, Sang-Soo; Kim, Heesuk |
| 2023-03 | Stretchable conductive nanocomposites of low electrical percolation threshold for washable high-performance-interconnects | Kwag, Seungho; Ko, Youngpyo; Jeon, Jun-Young; Jang, Doojoon; Park, Minju; Choi, Yoohyeon; Cho, Jinhan; Kim, Heesuk |
| - | Synthesis and Characterization of Graphene Oxide Nanosheet Wrapped White-Emissive Conjugated-Polymer Nanoparticles | You Dongyoun; Nguyen Dien Kha Tu; Lee Su Jin; Eunji Lee; Ho Sun Lim; Kim, Heesuk; Jung Ah Lim |
| 2013-09 | Thermoelectric Properties of Graphite Nanosheets/Poly(vinylidene fluoride) Composites | Yoon, Ho Dong; Nam, Seungwoong; Tu, Nguyen D. K.; Kim, Daeheum; Kim, Heesuk |
| 2012-04 | Three-Dimensional Monte Carlo Simulation of the Electrical Conductivity of Carbon Nanotube/Polymer Composites | Lee, Dong Choon; Kwon, Gyemin; Kim, Heesuk; Lee, Hyun-Jung; Sung, Bong June |
| 2015-10-07 | Translational and rotational diffusion of a single nanorod in unentangled polymer melts | Kim, Min Jung; Cho, Hyun Woo; Kim, Jeongmin; Kim, Heesuk; Sung, Bong June |
| 2022-12 | Ultrafast Real-Time PCR in Photothermal Microparticles | Kim, Bong Kyun; Lee, Sang-A; Park, Minju; Jeon, Eui Ju; Kim, Mi Jung; Kim, Jung Min; Kim, Heesuk; Jung, Seungwon; Kim, Sang Kyung |
| 2023-12 | Understanding secondary phase inclusion and composition variations in the microstructure design of n-type Bi2Te3 alloys via selective dissolution of KCl | Park, Gwang Min; Lee, Seunghyeok; Kang, Jun-Yun; Baek, Seung-Hyub; Kim, Heesuk; Kim, Jin-Sang; Kim, Seong Keun |
| 2024-04 | Unlocking the Potential of Porous Bi2Te3-Based Thermoelectrics Using Precise Interface Engineering through Atomic Layer Deposition | Lee, Seunghyeok; Park, Gwang Min; Kim, Younghoon; Lee, So-Hyeon; Jung, Sung-Jin; Hong, Junpyo; Kim, Sung-Chul; Won, Sung Ok; Lee, Albert S.; Chung, Yoon Jang; Kim, Ju-Young; Kim, Heesuk; Baek, Seung-Hyub; Kim, Jin-Sang; Park, Tae Joo; Kim, Seong Keun |
| 2023-09 | Visibly transparent UV protection and adjusted mechanical properties of films composed of lignin-derived wastes and poly[(R)-3-hydroxybutyric acid] | Karnitski, Aliaksandr; Choi, Jae-Wook; Kim, Heesuk; Yoo, Chun-Jae; Lee, Hyunjoo; Suh, Dong Jin; Kim, Kwang Ho; Kim, Changsoo; Kim, Kyeongsu; Ha, Jeong-Myeong |
| - | (Undefined) | Kim, Heesuk |
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