Showing results 1 to 2 of 2
Issue Date | Title | Author(s) |
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2021-05-20 | Heat transfer analysis of variable stiffness endoscope utilizing thermoplastic and thermoelectric device inside large intestine | KIM SEUNGWON; Kim Myoungju; KIM JUYEONG; Park Jaehyeon |
2021-11-26 | Thermomechanical analysis of a variable stiffness mechanism using thermoplastic and thermoelectric module for endoscopic applications | KIM SEUNGWON |