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Showing results 1 to 4 of 4

Issue DateTitleAuthor(s)
-Characteristics of pulse plasma enhanced atomic layer deposition of tungsten nitride diffusion barrier for copper interconnect.Kim Yong Tae; 심현상
-Effects PECVD W-N diffusion barrier on thermal stress and electrical properties of Cu/W-N/SiOF multilevel interconnectKim Yong Tae; 김동준; 이석형; PARK YOUNG KYUN; 김익수; 박종완
-Improvement in diffusion barrier properties of PECVD W-N thin film by low energy BF2+ implantation김동준; Kim Yong Tae; PARK YOUNG KYUN; 심현상; 박종완
2001-03Improvement of the reliability of a Cu/W-N/SiOF multilevel interconnect by inserting plasma enhanced chemical vapor deposited W-N thin filmKim, DJ; Sim, HS; Lee, S; Kim, YT; Kim, SI; Park, JW
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