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Effects PECVD W-N diffusion barrier on thermal stress and electrical properties of Cu/W-N/SiOF multilevel interconnect

Authors

Kim Yong Tae; 김동준; 이석형; PARK YOUNG KYUN; 김익수; 박종완

Citation

Proc. of EOS/SPIE Symposium on Microelectronic Manufacturing Technologies

Keywords

PECVD; SiOF; W-N; diffusion barrier

URI

https://pubs.kist.re.kr/handle/201004/109837

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KIST Conference Paper > Others

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