Showing results 1 to 2 of 2
Issue Date | Title | Author(s) |
---|---|---|
- | Investigation of improved adhesion between Cu films and polyimide by PSII-EIAMAD technique | LEE, YEON HEE; Hong Ju Hi; 천혜진; HAN, SEUNG HEE |
2003-02 | Surface properties and characterization of PSII-modified polymers | 이연희; 한승희; 권문희; 김영수; 천혜진 |