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Showing results 1 to 2 of 2

Issue DateTitleAuthor(s)
-Flexible module packaging using MEMS technology황은수; 최석문; Ju Byeong Kwon; 김용준
-Flexible polysilicon sensor array modules using "Etch-Release" Packaging Scheme황은수; 김용준; Ju Byeong Kwon

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