KIST Library Institutional Repository

Flexible module packaging using MEMS technology

Other Titles

MEMS 기술을 이용한 flexible module packaging

Authors

황은수; 최석문; Ju Byeong Kwon; 김용준

Citation

마이크로 전자 및 패키징학회 춘계 기술 심포지움, pp.74 - 78

URI

https://pubs.kist.re.kr/handle/201004/106902

Appears in Collections:

KIST Conference Paper > Others

Files in This Item:

There are no files associated with this item.

Export

RIS (EndNote)

XLS (Excel)

XML