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Showing results 1 to 5 of 5

Issue DateTitleAuthor(s)
2024-04-26Enhancing Storage Stability and Mechanical Property of One-Component Epoxy via Dry Encapsulated and Isocyanate-Blocked ImidazoleJang, Han Gyeol; Lim, Deok Jae; An, So Hyun; Park, Jong Hyuk; Park, Min; Lee, Doh C.; Kim, Jaewoo
2024-11Exploring synthesis techniques for an imidazole-based one-component epoxy latent curing agent: Chemical capping and mechano-chemical capsulingJang, Han Gyeol; Lim, Deok Jae; An, So Hyun; Park, Jong Hyuk; Park, Min; Park, Jinwoo; Park, Hyungbum; Kim, Byeong-Su; Lee, Doh C.; Kim, Jaewoo
2024-10-01Low-temperature fast-curing cationic latent curing agent for one-component epoxy adhesives for electronic materialsAn, So Hyun; Jang, Han Gyeol; Kim, Sun Joo; Kim, Jaewoo
2024-09-30Pioneering Synthesis Techniques for an Imidazole-based One-component Epoxy Latent Curing Agent: Chemical Capping and Mechano-chemical CapsulingLim, Deok Jae; Jang, Han Gyeol; An, So Hyun; Park, Jong Hyuk; Park, Min; Lee, Doh C.; Kim, Jaewoo
2024-11전자 재료용 일액형 에폭시 접착제를 위한 저온 속경화 잠재성 양이온 경화제An, So Hyun; Jang, Han Gyeol; Joung, Young Hoon; Kim, Seung Jun; Kim, Myung Woong; Kim, Felix Sunjoo; Kim, Jaewoo
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