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Issue DateTitleAuthor(s)
-3D volumetric ultrasound imaging with a 32×32 CMUT array integrated with front-end ICs using flip-chip bonding technologyAnshuman Bhuyan; Jung Woo Choe; Lee, Byung Chul; Ira Wygant; Amin Nikoozadeh; Omer Oralkan; Butrus T. Khuri-Yakub
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