KIST Library Institutional Repository

3D volumetric ultrasound imaging with a 32×32 CMUT array integrated with front-end ICs using flip-chip bonding technology

Authors

Anshuman Bhuyan; Jung Woo Choe; Lee, Byung Chul; Ira Wygant; Amin Nikoozadeh; Omer Oralkan; Butrus T. Khuri-Yakub

Citation

IEEE International Solid-State Circuits Conference Digest of Technical Papers 2013, pp.396 - 397

URI

https://pubs.kist.re.kr/handle/201004/89452

Appears in Collections:

KIST Conference Paper > Others

Files in This Item:

There are no files associated with this item.

Export

RIS (EndNote)

XLS (Excel)

XML