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Showing results 1 to 6 of 6

Issue DateTitleAuthor(s)
2003-01Design and fabrication of a significantly shortened multimode interference coupler for polarization splitter applicationHong, JM; Ryu, HH; Park, SR; Jeong, JW; Lee, SG; Lee, EH; Park, SG; Woo, D; Kim, S; O, BH
1998-11Electrostatic bonding of silicon-to-ITO coated #7059 glass using Li-doped oxide interlayerJeong, JW; Ju, BK; Lee, DJ; Lee, YH; Oh, MH; Choi, DJ
1997-12Experimental analysis on the anodic bonding with an evaporated glass layerChoi, WB; Ju, BK; Lee, YH; Jeong, JW; Haskard, MR; Lee, NY; Sung, MY; Oh, MH
2001-07New plasma display panel packaging technology using electrostatic bonding methodLee, DJ; Jeong, JW; Kim, YC; Lee, YH; Ju, BK; Cho, TS; Choi, EH; Jang, J
1999-01Novel bonding technology for hermetically sealed silicon micropackageLee, DJ; Ju, BK; Choi, WB; Jeong, JW; Lee, YH; Jang, J; Lee, KB; Oh, MH
1999Vacuum packaging using anodic bonding and emission characteristics of FEDLee, DJ; Ju, BK; Jeong, JW; Kim, H; Jung, SJ; Jang, J; Oh, MH
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